Renesas Technology to jointly promote

Renesas Technology Corp. today announced plans to use the industry’s smallest lead-free packages for logic ICs, “NanoFree™”*1, for standard logic ICs to be used in portable devices such as mobile phones and PDCs that require small size and low voltage, and to promote these packages jointly with Texas Instruments Incorporated (TI).

These packages are WCSPs (Wafer level Chip Scale Packages) of almost the same size as the chip, and at 1.4 mm × 0.9 mm × 0.5 mm (max.), offer an approximately 70% reduction in mounting area compared with Renesas Technology’s previous 5-pin standard logic IC packages (Renesas Technology package code: CMPAK-5).

The two companies will ensure a stable supply to the market by respective development of high-speed, low-voltage standard logic ICs using these packages with an alternative source partnership.

As initial NanoFree™ products in Renesas Technology, we have developed the HD74LVC1G Series of high-speed, low-voltage Unilogic ICs sharing the specifications of TI’s SN74LVC1G Series high-speed, low-voltage logic IC NanoFree™ products. Initially, sample shipments of two models, the HD74LVC1G04 and HD74LVC1G97, will begin in Japan in June 2003.

“Unilogic IC” is Renesas Technology’s name for a small-unit standard logic IC incorporating from single to triple gates in a single package. These Unilogic ICs simplify wiring and enable circuit modifications due to design changes to be implemented speedily.