企业 个人 用户名 密码   忘记密码?
站内 站外
风格设定:
论坛 博客 会展
论坛 博客 会展
 
NS SDALTEVK三速SDI时钟方案
作者:    时间:2008-09-10    来源:eaw 
 
       The 3G SDI SerDes evaluation system consists of:
Cyclone III FPGA development board (sold separately by Altera)
National SDI video and clocking daughter card (SDALTEVK)
Comprehensive user manual, schematics, and bill of materials (BOM)
FPGA IP
Nationals daughter card, SDALTEVK, includes synthesizable FPGA source code available in both Verilog and VHDL to maximize flexibility and facilitate IP customization. The daughter card, available as an option, plugs directly into the Altera Cyclone III development board via Alteras high-speed mezzanine connector (HSMC).
The SDALTEVK daughter card contains:
LMH0344 Triple-rate SDI Adaptive Cable Equalizer
LMH0340 Triple-rate SDI Serializer with integrated cable driver
LMH0341 Triple-rate SDI deserializer with reclocked loop through
LMH1981 Multi-Format Video Sync Separator
LMH1982 Multi-Rate Video Clock Generator
DS90CP22 2x2 LVDS Crosspoint Switch
LP3878 Adjustable Low Noise LDO
LM20242 PowerWise Buck Regulator
The SDALTEVK supports a complete 3G-SDI signal path consisting of adaptive cable equalizer (LMH0344), deserializer with reclocked loop through (LMH0341) and serializer with integrated cable driver (LMH0340). A multi-rate sync separator (LMH1981) and clock generator (LMH1982) deliver ultra-low jitter reference clocks to the host FPGA. A 2x2 LVDS crosspoint switch (DS90CP22) acts as a reference clock selector to choose between four separate clocking options:
Recovered clock from LMH0341 deserializer
Genlock from analog reference, LMH1981 sync separator and LMH1982 clock generator
Local clock generation from LMH1982 in free-run mode
External clock via SMA connector



EVK Block Diagram



EVK Connection Diagram



SDALTEVK
















标签:  3G  SDI时钟  NS  SDALTEVK  FPGA


  发表评论

昵称: 验证码:
内容:
 
相关新闻
 · 用DSP应对3G手机的语音识别应用
 · 纵观3G基站开发的变化
 · 3G测试问题更加严峻
 · TTPCom AJAR&nb
 · 手机设计技术论坛导航产业发展趋势
 · 如何使3G芯片拥有更广阔的市场
 · 3G中的CMOS基RF集成
 · 通信系统电源设计
最新资讯
 · 设计3G手机终端需要考虑的七个要素
 · 3.5G/HSDPA技术架构与手机开发
 · 3G为什么火不了?早期3G手机D-21
 · 便携式产品低功耗电路设计的综合考虑
 · EDGE手机基带处理设计的几种实现方法
 · 干扰对CDMA手机接收器测试的影响
 · 镁合金PDA外壳锻件之研究与开发
 · 美光200万像素CMOS手机相机完整解
 
  站内 站外
  Copyright(C)2008 Electronic Design & Application World All rights reserved.  《电子设计应用》杂志社 版权所有
联系电话:(86)10-66421136 66421836 66423836   传真:(86)10-66423936   京ICP备05012822号