Cinch Unveils New Cinch iQ Flex

Cinch Connectors, Inc., a multi-national manufacturer of a broad range of interconnect products, today unveiled a solderless, board-to-board, compression style interconnection solution that blends the Cinch iQ connector with a flex circuit and compression system.

"Our Cinch iQ Flex Circuit Assembly Solutions are designed for a variety of board-to-board applications, such as co-planar, parallel, stacked, multi-level and backplane boards," said Kevin Honan, Z-axis Product Manager.

Lots of Choices

To accommodate increased circuit density, functionality and performance in smaller and smaller packages, designers make use of three dimensions by connecting boards in parallel to one another. However, that makes interconnecting them a growing challenge. Cinch Connectors is responding to that challenge with its Cinch iQ Flex Circuit Assembly Solutions.

With a number of I/O interconnects ranging from less than 10 to over 400, the ability to match custom footprints, and a pitch as low as 1 mm, Cinch is making it easier for designers to create multi-board solutions tailored to their exact requirements.

Cinch's high-speed, low-profile, Cinch iQ technology offers low-self-inductance and low-resistance paths. As a result, the interconnect design can handle higher-speed signals. The high-density interconnect allows designers to optimize space on their printed circuit boards. Also, the solderless compression system is easy to use and permits fast rework.

Price and Delivery

Cinch's engineers are available to begin designing custom Cinch iQ Flex Circuit Assembly Solutions now. Prices vary based on the number of I/O connections and degree of customization.