Acronym |
Definition |
Meaning |
AAS |
Atomic absorption spectroscopy |
|
ABS |
Acrylonitrile butadiene styrene |
|
ASO |
Ag / Sn / O2 |
Silver Tin Oxide |
AgSnO2 |
Ag / Sn / O2 |
Silver tin oxide |
Ag |
Silver |
Chemical Symbol |
BGA |
Ball Grid Array |
|
Bi |
Bismuth |
Chemical Symbol |
CAF |
Conductive anodic filament |
|
Cd |
Cadmium |
Chemical Symbol |
Cr (VI) |
Hexavalent Chromium |
Chemical Symbol |
CRT |
Cathode ray tube |
|
CSP |
Chip Scale Package |
|
DEFRA |
Department of the Environment, Food & Rural Affairs |
UK Government environment ministry |
DTI |
Department of Trade & Industry |
Key |
EC |
European Commission |
|
ED-XRF |
Energy dispersive X-Ray fluorescence analysis |
|
EEE |
Electrical and electronic equipment |
|
ELV |
End of Live Vehicles |
EU Directive |
ESH |
Environmental Safety & Health |
|
FR4 |
A material used as a substrate for a PCB, made of fibreglass & epoxy |
|
FTIR |
Fourier transform infra-red (spectroscopy) |
|
GCMS |
Gas chromatography mass spectroscopy |
|
HASL |
Hot Air Solder Leveling |
|
Hg |
Mercury |
Chemical Symbol |
HPLC |
High performance liquid chromatography |
|
IC |
Integrated circuit or ion chromatography depending on context |
|
ICP |
Inductively coupled plasma spectroscopy |
|
IT |
Information Technology |
|
LFS |
Lead Free Soldering |
|
m.pt. |
Melting point |
|
MCV |
Maximum Concentration Value |
|
MLCC |
Multilayer ceramic capacitors |
|
MSL |
Moisture sensitivity level |
|
NiAu |
Nickel / Gold |
|
OEM |
Original equipment manufacturer |
|
Pb |
Lead |
Chemical Symbol |
PBB |
Polybrominated Biphenyls |
Flame retardant chemical |
PBDE |
Polybrominated Diphenyl Ether |
Flame retardant chemical |
PCB |
Printed Circuit Board |
|
PVC |
Poly vinyl chloride |
|
QA |
Quality assurance |
|
RoHS |
Restriction of the use of certain hazardous substances |
EU Directive |
SAB |
Sn / Ag / Bi |
Tin Silver Bismuth alloy |
SABC |
Sn / Ag / Bi / Cu |
Tin Silver Bismuth Copper alloy |
SAC |
Sn / Ag / Cu |
Tin Silver Copper alloy |
SAC305 |
Sn / Ag 3.0% / 0.5% Cu |
Alloy mix percentiles |
SAC385 |
Sn / Ag 3.8% / 0.5% Cu |
Alloy mix percentiles |
SAC408 |
Sn / Ag 4% / 0.8% Cu |
Alloy mix percentiles |
SEM/EDX |
Scanning electron microscope / energy dispersive X-ray analysis |
|
SME |
Small and medium sized enterprises |
|
Sn |
Tin |
Chemical Symbol |
TAC |
Adaption Committee |
EU Technical Committee |
TCE |
Thermal coefficient of expansion |
|
TCF |
Technical compliance file |
|
Tg |
Glass transition temperature |
|
VOC |
Volatile Octane Compound |
|
WD-XRF |
Wavelength dispersive X-Ray fluorescence analysis |
|
WEEE |
Waste electrical and electronic equipment |
EU Directive |