意法半导体（ST）长期以来一直是中国半导体市场的领导者，上个世纪80年代中期，意法半导体在北京设立了第一个办事处，成为第一批在中国设立营业机构的半导体公司之一。今天， ST在中国共有员工3100人，其中800多名专门从事设计、技术支持和市场销售工作。公司已经建立起完善的销售网络，并在中国各地，如北京、上海、深圳、厦门、成都、苏州和青岛设立了销售办事处，向不断增长的中国客户提供直接服务。
1996年，意法半导体（ST）与深圳赛格集团有限公司（SEG）的子公司深圳赛格高技术投资股份有限公司在深圳福田保税区合资建立了ST在中国的第一家封装测试厂深圳赛意法微电子有限公司（STS），合资企业是目前世界上技术最先进的芯片后端制造厂之一，承担各种半导体元器件的封装和测试业务，产品包括功率MOS晶体管、专用集成电路和标准线性器件等。
该后端制造厂与同年设立的ST深圳设计中心实现了优势互补，以满足国内市场对定制微芯片日益增长的需求。深圳设计中心具备从规格说明到规模化生产设计世界一流芯片的能力，作为国内最先进的定制IC设计中心之一，得到了中国政府广泛认可。2002年，ST的设计业务得到进一步扩展，与清华大学深圳研究生院合作成立了ASIC研究中心，以研究和开发基于先进数字和混合信号的专用集成电路（ASIC）为目标。由于许多新企业在上海周边地区建厂，2004年底，ST在上海又开设了另一家设计中心。
由于解决方案本地化对于中国消费者变得日益重要，ST在北京、上海、深圳建立了多家技术资格中心，针对数字消费多媒体、影像、显示、无线、网络和智能卡等各种应用，配备了从事参考解决方案的设计开发、技术支持及合作开发项目的各类专业技术工程师。这几家技术资格中心补充了ST在世界其它地区的现有技术资格中心的实力，使公司能够调配其全球资源和各种先进技术，以满足中国市场的特殊需求。
2004年11月，意法半导体（ST）宣布与韩国海力士半导体有限公司（Hynix）在江苏无锡合资建立一个存储器芯片前端制造厂，无锡毗邻中国最大的城市之一－上海，具有丰富的高技能劳动力资源和稳定的基础设施。合资企业的建立是两家公司在NAND闪存开发制造上的合作关系的合理延伸，这个先进的制造厂将拥有18,000多平米的洁净室，8英寸和12英寸两条生产线将会提高意法半导体（ST）公司NAND闪存的产能，同时海力士半导体（Hynix）的成本效益型DRAM的制造能力亦将给ST带来好处。无锡制造厂计划在2006年开始批量生产，届时将会为合资双方带来成本效益型的制造能力，更快地进入高速增长的中国IT、电信和消费电子等市场。
STMicroelectronics (ST), a long-time leader in the China semiconductor market, was one of the first semiconductor manufacturers to set up operations in China. Since then, ST has established a strong integrated presence in the country, encompassing not only a highly successful Sales and Marketing organization but also important manufacturing, design and research operations. Today, ST employs around 3100 people in China, of which more than 800 are dedicated to design, application support, and sales and marketing.
The Company has a strong network of distributors and sales/liaison offices in all parts of China, including Beijing, Shanghai, Shenzhen, Xiamen, Chengdu, Suzhou and Qingdao to directly serve its growing legion of Chinese customers.
In keeping with its principle of establishing a truly integrated presence in the major macroeconomic regions, ST set up its first assembly and test plant in China in 1996. Located in the Futian Free-Trade Zone of Shenzhen, the plant is one of the best in the world with its state-of-the-art technology. Operating as part of the joint-venture agreement between STMicroelectronics and Shenzhen High Tech Industrial Company Ltd (SHIC), a subsidiary of the Shenzhen Electronics Group (SEG), the Shenzhen STS Microelectronics back-end facility assembles and tests a wide range of semiconductor components, including PowerMOS transistors, application-specific ICs, and standard linear devices.
Complementing the back-end plant is ST誷 Shenzhen Design Center, which was established in 1996 to cater to the growing local demand for microchips tailored to the Chinese market. The Design Center誷 ability to provide world-class silicon design from specification definition to volume production has won the center recognition from the Chinese government as one of the most advanced custom IC design facilities in the country. ST誷 design activities in China were further extended in 2002 with the creation of a joint ASIC design center set up with the Shenzhen Graduate School of Tsinghua University. This center誷 charge is to design and develop application specific integrated circuits (ASIC) using advanced digital and mixed-signal technologies, in which ST is a worldwide leader. Another design center was opened in Shanghai at the end of 2004.
ST has also set up a number of competence centers in Beijing, Shanghai, and Shenzhen staffed with technical specialists to handle the design and development of reference solutions, technical support, and joint development work for a wide range of applications in digital consumer multimedia, imaging, display, wireless, networking, and smartcards. These competence centers supplement ST誷 existing centers in other parts of the world and allow the Company to deploy its worldwide resources and broad portfolio of leading-edge technologies to meet the particular local needs of the Chinese market.
Most recently, in November 2004, ST announced a joint venture with Hynix Semiconductor of Korea to build a front-end memory manufacturing plant in Wuxi City, Jiangsu Province, whose proximity to Shanghai offers a skilled labor pool and a robust infrastructure. A logical extension of the successful cooperation in NAND Flash development and manufacturing between the two companies, the new leading-edge facility with clean-room space of more than 18,000 square meters and both 8in and 12in manufacturing lines will increase ST誷 NAND Flash capacity and allow it to benefit from Hynix’cost-effective DRAM capabilities. The Wuxi plant, scheduled to begin volume production in 2006, will provide both companies with cost-efficient manufacturing capacity and better access to China誷 rapidly growing IT, Telecom, and Consumer markets.
北京办事处
地址：中国北京海淀区知春路49号希格玛
大厦一层东侧28号(100080)
电话： 010-88097398 传真：010-88097171
深圳办事处
地址：广东省深圳市深圳市高新技术开发区高
新南1道TCL 大厦B座6、7楼(518057)
电话： 0755-86012000 传真：0755-86012200
厦门办事处
地址：厦门市厦禾路189号银行中心9楼10室
电话： 0592-2684890 传真：0592-2684700