Infineon X-GOLDTM613低成本3G移动互联网解决方案

Infineon 公司的X-GOLDTM613是低成本3G移动互联网浏览和信息解决方案,包括了2G/3G数字基带和功率管理功能,是采用65nm CMOS技术的手机系统级芯片. X-GOLDTM613集成了功能强大的基于ARM11的MCU,丰富的多媒体特性,具有用于照相机,显示器,存储卡和3G空中接口,音乐和视频,FM无线电收音机和短信,并提供完整的调制解调器功能,包括3G双频带, HSDPA cat 6 (3.6Mbps)以及Quadband EDGE.本文介绍了X-GOLDTM613的主要特性,应用方框图以及3G浏览和信息手机平台主要特性.

X-GOLDTM613:3G Low-Cost Solution for Mobile Internet Browsing & Messaging

The Infineon X-GOLDTM613 is a cellular System-on-Chip comprising of 2G/3G digital and analog baseband plus power management functionality, all monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd generation 2G/3G baseband solution and is taking the next step in bringing enhanced modem features such as HSDPA to the mass market. Following on the success of the X-GOLDTM213, which brought Internet Browsing, Music & Video, Camera, FM Radio and Messaging into the low-cost market, the X-GOLDTM613 now sets a new standard with the introduction of low-cost 3G solutions for Web 2.0 applications and enhanced mobile internet experience.
This chip is designed for low-cost cellular phones addressing the 3G mobile market. It brings together a powerful ARM11 based MCU, rich multimedia features with dedicated interfaces for camera, display, USB, memory cards and the benefits of a 3G air interface. The X-GOLDTM613 provides the complete modem functionality up to 3G Dual-band, HSDPA cat 6 (3.6Mbps) and Quadband EDGE. It comes in a flip-chip package with a 0.5mm pitch to enable lowcost PCB technologies.
X-GOLDTM613 powers the XMMTM6130 platform solution, a reference design with a complete, system-cost optimized RF engine and an integrated Release 6 dual-mode protocol stack with a common software API layer (UTA) to reduce the porting effort of customers’ user interface and application framework. This offers XMMTM2130 customers the scalability to easily migrate from 2G to 3G market segments. The integration of all baseband and power management functions in combination with Infineon’s SMARTiTMUEmicro RF engine enables a PCB footprint below 9cm2 for Dual-band 3G and Quad-band EDGE. The solution is validated with an inter-operability test program at infrastructure vendors and operators to significantly reduce time to market for our customers.



图1. X-GOLDTM613外形图
主要特性:
Modem
HSDPA: 3.6Mbps
WCDMA: 384kbps DL/UL
EDGE: MSC class 12
Speech: NB-AMR, WB-AMR
SAIC
CPU
ARM1176 @ 312MHz
Memory
NOR & NAND Flash
LPDDR1, SDRAM
eMMC
Multimedia and Applications
MIPI CSI-2 up to 3 Mpixel with JPEG HW accelerator
Display interface, parallel 8/9-bit with 2D graphic accelerator
Video
Playback: MPEG4, H.263 with QVGA@15fps
Record: MPEG4, H.263 with QCIF @ 15fps
Audio functionality
Digital and analog microphone interface
Speaker support
Connectivity and Interfaces
Digital RF interface V3.09
Direct (U)SIM
USB 2.0 HS including PHY
3 x USIF; 1xI2S; 2xI2C
Memory card interface SD(SDHC) / MMC / SDIO
Package
F2BGA, 10x10x0.8mm
0.5mm pitch, 292 balls



图2.X-GOLDTM613方框图



图3.XMMTM6130 3G浏览和信息手机平台外形图
平台特性:
Modem Area < 9cm2, ~ 100 components
6-Layer PCB
FM Radio, Bluetooth combo
USB 2.0 HS
Infineon Software Solution
Infineon User Interface
Infineon Multimedia Framework
3GPP Release 6 Protocol Stack
JAVA, MIDP2.0, JTWI package (185), JSR 75, JSR 135
WAP 2.0, MMS, IM
3G Dual-band or Single-band
Dual- or Quad-band GPRS/EDGE