SANTA CLARA, CA--(Marketwire - November 19, 2009) - Tensilica,® Inc. today announced that the Digital Media & Communications Business of Samsung Electronics has signed a multi-year license to Tensilica's HiFi 2 Audio DSP (digital signal processor) for use in Samsung's multimedia system products after a successful previous deployment in Samsung's System LSI Division. Tensilica's HiFi architecture is the most popular commercial audio core for system-on-chip (SOC) designs.
"We selected the Tensilica HiFi Audio DSP because of its impressive performance capabilities and because of the breadth of software codecs available," stated K.W. Chun, vice president, Digital Media & Communications Business of Samsung Electronics. "The HiFi 2 Audio DSP can execute the most demanding multi-channel audio algorithms at remarkably low MHz and low power."
"We are pleased that another major division of Samsung Electronics has selected our HiFi 2 Audio DSP for their next-generation home entertainment products," stated Jack Guedj, Tensilica's president and CEO.